Photonic Curing utilizes a pulsed broadband flash of light to thermally process high temperature coatings on temperature sensitive substrates. The efficient light absorption by nanoparticles (such as those commonly used in conductive inks) allows the development of a transient thermal gradient which results in the metalized surface to reach significantly higher temperature than the substrate itself. This non-equilibrium process is perfectly suited for electronic circuits on flexible, low cost substrates such as paper, PET and other polymers. In this presentation, we will provide a broad overview of the photonic curing process and how designing the appropriate pulse structure can be used to optimize material properties. Utilizing simulation to extract significant processing information to corroborate experimental results will be demonstrated. Besides the advantage of processing on low temperature substrates, photonic curing is a very rapid thermal process (in the time scale of a few ms). This enables the introduction of curing steps into roll to roll and conveyor based material processing setups with minimal equipment footprint. The processing environment designed around photonic curing offers product innovators and manufacturers of printed electronics significant advantages over conventional thermal processing.