Atomic layer deposition (ALD) is differentiated from other thin film deposition techniques due to self-limiting growth, which gives rise to unique film attributes: extremely conformal, dense, pin-hole-free continuous coverage. Recent advancements in ALD processing have enabled barrier coating on flexible substrates in a roll-to-roll fashion at production rates compatible with commercial packaging applications. A process has been previously demonstrated in which spatial ALD has been used to coat PET web running at 300 m/min with a 4.5 nm mixed oxide film, resulting in WVTR of 0.005 g/(m2·d) for less than $0.03/m2. It has been shown previously that spatial ALD can coat PET web running at 300 m/min with a 4.5 nm mixed oxide film, resulting in WVTR of 0.005 g/(m2·d) for less than $0.03/m2. This paper further explores commercial packaging applications of this process by examining the impact of substrate, such as BOPP, and downstream converting operations, such as rewind damage and laminations, on barrier performance.