Dual Magnetron Sputtering of Aluminum Oxide for Low Temperature High Rate Processing

Dual Magnetron Sputtering of Aluminum Oxide for Low Temperature High Rate Processing

Scott Jones
3M

A technique for depositing non-conductive oxides using bi-polar pulsed DC power supplies and planar targets has been shown to achieve deposition rates significantly higher than those from more standard Mid Frequency (MF) AC sputtering techniques. This method involves the use of two bi-polar pulsed DC power supplies each connected to a separate cathode and a common anode. In this manuscript, the use of this technique to reactively deposit aluminum oxide from rotary cathodes using metallic targets will be reported. Hysteresis loops using voltage control of the bi-polar pulsed DC power supply, deposition rates, film properties and process conditions such as system temperatures are presented and compared to those from a standard MF AC deposition process.